DART Filing · Auto-translated
📌 Key Filing Highlights
- Event: Participation in the Morgan Stanley Asia Pacific Summit for Investor Relations (IR).
- Date & Location: November 18, 2026, in Singapore.
- Target Audience: Major global institutional investors.
- Core Focus: Presentation of the 2027 Global Growth Strategy, focusing on High Bandwidth Memory (HBM) and AI packaging equipment expansion.
Filing Overview and Core Decision
On November 11, 2026, Hanmi Semiconductor officially disclosed its plan to hold an Investor Relations (IR) event in Singapore. The company will participate in the Morgan Stanley Asia Pacific Summit to communicate its long-term strategic roadmap and growth initiatives to major global institutional investors through a series of one-on-one and group meetings.
Detailed Filing Terms and Specifications
| Metric | Details |
|---|---|
| Date | November 18, 2026 |
| Location | Singapore |
| Participants | Major global institutional investors |
| Purpose | Participation in Morgan Stanley Asia Pacific Summit |
| Method | One-on-One and Group Meetings |
| Sponsoring Institution | Morgan Stanley |
| Decision Date | November 11, 2026 |
Operational Purpose and Company Rationale
The primary objective of this IR event is to present “Hanmi Semiconductor’s 2027 Global Growth Strategy,” which includes the following key operational goals:
- HBM Market Expansion: Increasing market share in the High Bandwidth Memory (HBM) TC Bonder market and supplying TC Bonders for HBM4/4E production.
- Customer Base Diversification: Commencing the supply of AI package TC Bonders (3 types) and FC Bonders (2 types) to Foundry and OSAT customers.
- Advanced Packaging Response: Expanding the supply of large-area singulation equipment (MSVP) to meet demand for Panel Level Packaging (PLP), FCBGA, and Glass Substrates.
- Capacity Expansion: Addressing the shortage of AI semiconductor equipment through the construction of Plant 7 and the acquisition of a new Plant 8.
- U.S. Market Entry: Expanding the new customer base in the United States by supplying TC Bonders (for AI packages/HBM) and EMI equipment for aerospace applications.